MPi Parametric Probe Cards






Canteliver Probe Card

MPI Cantilever Probe Card is extensively used on gold bump and pad wafer tests for Screen driver, logic, and memory product. MPI’s cantilever probes are definitely the corresponding answer to the calls for of fi­ne pitch, smaller pad sizing, high velocity, much less cleansing, multi-DUT, significant pin rely, and ultra-low leakage demands. With exceptional craftsmanship, modern architecture and tested methodologies dependant on mechanical and electrical simulation/measurement final results, building MPI the highest cantilever company around the world.


FCB Probe Card

The FCB Probe Card is considered the most experienced technological innovation of buckling beam probe card. It really is aimed to realize the semiconductor ship manufacture time-to-current market (TTM) and price of exam (COT) demand. FCB is often a demonstrated Alternative for a range of semiconductor output assessments from early engineering pilot-operates to large quantity producing (HVM). FCB is ready for unit requiring high sign integrity probing (SI) and/or electric power integrity probing (PI). Apps contain reducing-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, plus more. FCB assures the entire world’s very best In general Charge-of-possession (COO) for a variety of DUT applications.


EVS Probe Card

The EVS Probe Card can be an improvement about the standard buckling beam probe card. Critical capabilities are greater recent carrying ability (C.C.C.) and reduced balanced Get in touch with drive (BCF), together with All round MEMS-like characteristics. EVS can certainly meet the prerequisite of Superior wafer probing. Specific alignment and great planarity Command would be the vital variables contributing to steady Get hold of resistance. With its ability and functionality, EVS Probe Card is a great choice for advanced probe cards.


Osprey probe card

The Osprey probe card is MPI’s Alternative to demand from customers for at any time finer pitch. It really is designed for more compact Al pad, which is ideal for small pitch application with peripheral and whole array sample. With precise alignment and much better planarity Management, Osprey can arrive at greater productivity by multi-DUT layout.  The forming wire (FW) style needle produced with MPI’s personal micro fabrication approach not just delivers high-high quality general performance but will also allows simple needle substitute and shortens preserving cycle time.



Kestrel Probe Card

The Kestrel Probe Card is supplied with MEMS wire (MW) needle that's made for the need of minimal power probing. In addition, it includes the chance to satisfy high C.C.C. and high pin counts software. The MEMS system makes sure remarkably reliable needle features, along with the Particular construction style enables specific alignment and planarity Management.


MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, Logic Driver Probe Card enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.

https://www.mpi-corporation.com/probecard/

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